APPLICATION

Semiconductor, Flat Panel Display, Other Electronics

MARKET SEGMENT

Electronics

MATERIALS

Ta, Mo, Mo EBM, DynaMo, MoTi, MoNb, MoW, Arc-cast Mo, coated Mo, Nb Standard, grain stabil. Mo, Ta EBM, W

ADVANTAGES

High purity, texture and grain size controlled, high density & low defects.

H.C. Starck Solutions is well-known as a major international producer of tantalum products for the electronic, semiconductor and industrial markets.

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    Sputtering Targets

    Tantalum ingots, used in the production of tantalum sputtering targets, are electron beam (EB) melted, and have inherently high purity due to a combination of high vacuum settings, slow melting rates, multiple furnace passes, and careful control of all aspects of the process.

    Application

    Tantalum sputtering targets make thin coatings via a sputtering process for copper interconnect metallization, magnetic recording media, printer components, flat panel displays, optical and industrial glass, and thin film resistors.

    Dimensions

    H.C. Starck Solutions supplies both blanks and finished tantalum plates to manufacturers of sputtering targets. These targets meet exacting standards of purity and dimensional tolerances. Target blank sizes range from small research cathodes to large 100 pound planar targets. Typical thicknesses include .2″ to .7″, but thickness can be up to 1.5″ and greater. Typical diameters are 3″ to 18″. Typical rectangles are 6″ to 30″ or larger based on customer needs.

    Typical Tantalum Properties

    H.C. Starck Solutions offers a variety of options for texture controlled plates that lead to uniform thin film deposition characteristics throughout the target life.

    Electron beam (EB) melted, cross rolled, rolled and annealed:

    Density: 0.6 lb/in3 or 16.6 g/cm3
    Atomic Number: 73
    Atomic Weight: 180.95
    Purity: See chemistries below:

    Elements 3N5 Purity
    99.95% Ta
    3N8 Purity
    99.98% Ta
    4N Purity
    99.99% Ta
    4N5 Purity
    99.995% Ta
    Max. ppm Max. ppm Max. ppm Max ppm.
    Al 10 5 1 0,5
    Ca 10 5 1 1
    Cl 3 3 1 1
    Co 10 5 1 0,5
    Cr 10 5 1 0,5
    Cu 5 5 1 0,5
    Fe 50 20 5 1
    K 2 2 0,4 0,1
    Li 1 1 0,5 0,05
    Mg 10 5 1 0,5
    Mn 10 5 1 0,5
    Mo 50 20 10 10
    Na 1 1 0,4 0,4
    Nb 300 100 100 50
    Ni 20 10 5 1
    Pb 5 5 1 1
    Si 10 10 1 0,5
    Sn 10 5 1 1
    Ti 10 5 1 1
    V 5 5 1 1
    W 150 100 80 50
    Zn 5 5 1 1
    Zr 20 10 5 1
    Max Total
    Detectable Metallics

    500

    200
    100 50
    INTERSTITIALS
    C 40 40 30 30
    O 100 100 80 80
    H 10 10 10 5
    N 40 20 20 20
    S 10 10 5 1

    Tolerances

    Thickness: 
    Rolled and leveled plates have a normal thickness tolerance of ± 5% which can be tightened to ± .010″ at an added cost, depending on dimensions required.

    Flatness: 
    .005″ – .010″ TIR, depending on size and thickness

    Grain Size: 
    ASTM 4 or finer for targets made from plates under .4″ thick.

    High Purity Tantalum Chemistries

    There is a choice of purity levels with different prices and availability. Purity is measured by DC Plasma and gasses are measured by Leco analyzers. More detailed testing by GDMS (Glow Discharge Mass Spectrometry) is available.

    Conflict-free, Sustainable Tantalum Supply

    H.C. Starck Solutions only processes raw materials from ethically acceptable, conflict-free sources. This also applies for the procurement and processing of tantalum. We only purchase raw materials that meet the specifications of the OECD (“Due Diligence Guidelines for Supply Chains of Minerals from Conflict-Affected and High-Risk Areas”). Our company and its tantalum processing sites are certified in the context of the Conflict-Free Smelter (CFS) Validation Program of the independent Electronics Industry.