Composite alloys using a refractory metal bonded with copper exploit the outstanding thermomechanical properties of both materials, enabling the fabrication of high-temperature heat sinks for advanced electronics markets. H.C. Starck Solutions specializes in the fabrication of heat sinks with finely-tailored material ratios; providing solutions to demanding applications in the electronics industry.
Refractory Composites for Heat Sinks
H.C. Starck Solutions has decades of experience in the development of advanced materials for demanding thermal management applications. In tandem with the challenging dual trends of device miniaturization and increased functionality, the electronics industry consistently requires innovation when it comes to cooling. Materials must dissipate heat faster and more efficiently with a smaller component footprint.
Molybdenum- (Mo) and tungsten- (W) copper alloys rise to the challenges of thermal management in advanced electronics applications. H.C. Starck Solutions offers both molybdenum and tungsten composites with tunable ratios of refractory to copper to provide the optimal intersection between low coefficients of thermal expansion (CTE) and thermal conductivity. These are essential properties for regulating the heat generated from dense, high-performance electronic devices.
H.C. Starck Solutions offers low-density molybdenum-copper (MoCu) for heat sink applications, using a molybdenum skeleton infiltrated with copper at ratios of approximately 70:30 (Mo:Cu). This low-density composite is suitable for the most demanding electronics applications and is approved for military and aerospace applications. Tungsten-copper (WCu) composites are also available, with similarly high thermal properties, exceptional machinability, and varying ratios of tungsten to copper available on request. Contact a member of the H.C. Starck Solutions team to learn more.