Sheet / Plate / Foil

ADVANTAGES

H.C. Starck Solutions tantalum sheet and foil are popular for chemical processing applications, where customers can convert it into lining for columns, vessels, tanks, reactors, parts for heat exchangers, and more.

APPLICATION

High Temperature Processing

MARKET SEGMENT

Industrial Processing, Aerospace & Defense, Electronics

MATERIALS

Mo, Mo EBM, CuMoCu, MoCu, NiMoNi, TZM, MP35N, MoLa, Nb, Stabil. Nb, Nb EBM, Ta, Ta EBM, TaW, W, (W, Ni, Fe), NRC76, Ultra 76, Ultra 76 Plus, Ta10W

REQUEST A QUOTE

Please fill in the boxes on the contact form and a member of the team will contact you directly for a quotation.

Each quotation will be unique to the customer requirements so please give as much information in the contact form as possible, this will enable us to get the most accurate price back to you.


 

TANTALUM SHEET, PLATE, ROUND DISK AND FOIL

Customers transform our tantalum plate into products for military, chemical processing, and other anti-corrosion type applications.

Both tantalum sheet and plate are used by customers in the manufacturer of components for anticorrosion equipment. Round discs cut from tantalum plate are employed to repair and reinforcement work in anti-corrosion equipment.

Because of their strength and workability, very thin sheets of tantalum can be clad to other surfaces, providing superior corrosion protection and cost effectiveness.

Our tantalum sheet and plate are supplied with a cold-rolled and chemically cleaned surface. The sheet and plate may be locally conditioned to remove defects, provided that thickness tolerance is maintained.

Depending on your specifications and needs, all of our tantalum sheet, plate, and foil are visually inspected for slivers, laminations, excessive roll marks and handling scratches.

ULTRA76 Ta alloys offer higher corrosion resistance in most environments generating value added by extending product life time, reducing material thickness and improving processes throughput.

  • Higher temperatures possible, shorter cooling/heating cycle times
  • Constant surface finish (Ra<0.8 micrometers)
  • Material only from non-conflict sources, H.C. Starck Solutions is EICC certified
  • Uniform wall thickness
  • Best flatness for explosion clad applications

Dimensions

Form Thickness, Dia., Wall
inches (mm)
Width, Length
inches (mm)
Tantalum Foil 0.001“ to 0.005“
(0.025 to 0.1270 mm)
12“ maximum width x coil
(30.5 mm max. width x coil)
Tantalum Sheet 0.005“ to 0.020“
(0.1270 to 0.50 mm)
36“ maximum width x coil
(915 mm max. width x coil)
Tantalum Sheet 0.015“ to 0.060“
(0.380 to 1.524 mm)
40“ width x coil
(1000 mm width x coil)
Tantalum Round Disk Thickness: 0.060″ to 0.125″
(1.524 to 3.175 mm)
Up to 37 in diameter
Tantalum Plate 0.060“ to 0.125“
(1.524 to 3.175 mm)
width not to exceed 40“
(1000 mm)

*Total weight of finished plate not to exceed 350 Ib.

Mechanical Properties for Sheet and Plate

Grade and Form Ultimate Tensile Strength
min, psi (MPa)
Yield Strength
min, psi (MPa) (2% Offset)
Elongation
min, % (1 inch GL)
Unalloyed Tantalum (R05200), (R05400) Plate, Sheet and Strip
0.003“ – 0.060“ thick
>_ 0.060“ thick
30 000 (207)
25 000 (172)
20 000 (138)
15 000 (103)
20
30
97.5% Tantalum, 2.5% Tungsten,
(R05252) Sheet and Strip
Plate
40 000 (276)
40 000 (276)
30 000 (207)
28 000 (193)
20
20

Please contact us for additional sizes and requirements.

Tantalum and Tantalum Alloy Products:

Refer to Product Data Sheets for Tantalum for sizes:

PD-7033 NRC Ultra 76 Tantalum Alloy (Ta 2.5%W)
PD-7035 NRC Tantalum (UNS R05200)
PD-7036 NRC Tantalum Beam Melted Tantalum (ETA) (UNS R05200)

TUNGSTEN PLATE, SHEET, AND FOIL

Tungsten mill products available from H.C. Starck Solutions include plate, sheet, and foil with many options on width, length and thickness. Pure Tungsten flat rolled products are fabricated from pressed and sintered powder metallurgy ingot and are rolled to a wide range of plate, sheet, and foil thicknesses.

Flat rolled products

Pure Tungsten flat rolled products are fabricated from pressed and sintered powder metallurgy ingot and are rolled to a wide range of plate, sheet, and foil thicknesses.

The material is 99.95% pure Tungsten sheet and is normally supplied as-rolled in thicknesses below 0.030″, and stress relieved at that thickness and above.

Thickness Tolerance
Thickness Tolerance Width Tolerance Length Tolerance Flatness Tolerance
Thickness (Inches) (% of Thickness) (Inches) (Inches) (% Maximum)
.1875 to .625 ± 4  +.125 -0  +.125 -0 5
Over .500 to 1.125 ± 5  +.125 -0  +.125 -0 5

Plate camber (edge straightness) = Maximum .0625 inch per foot of length.

Plate will be sheared, abrasive cut, band saw cut, or water jet cut to the tolerances shown.

Surface Condition

Tungsten plate is normally supplied with a uniform matte finish, clean and free from foreign matter. Major surface defects will be removed by grinding provided that such conditioning does not reduce dimensions below specified limits.

PURE TUNGSTEN SHEET 4202

Physical Characteristics:

Thickness Tolerance
Thickness (Inches) Up to 12 Inches wide (Inches) Over 12 thru 24 Inches wide (Inches)
0.005 to 0.008 ± 0.0007
Over 0.008 to 0.011 ± 0.001
Over 0.011 to 0.015 ± 0.0012
Over 0.015 to 0.020 ± 0.0015
Over 0.020 to 0.040 ± 0.002
Over 0.040 to 0.187 ± 5 % ± 5 %

*For thickness 0.040 to 0.187 inches; sheet will be sheared, abrasive cut, band saw cut, or water jet cut to the tolerances shown.

Bedsheet is sold as a useable width, therefore any cracks or delaminations on the edges are acceptable as long as a 6, 12 or 24 inch minimum width can be yielded from the material.

Length Tolerance

For specified lengths, the tolerance for all sizes is + .0625 – 0 inch per foot of length. Edge Straightness-Maximum camber is .0625 inch per foot of length.

Flatness Tolerance

The total deviation from flatness will not exceed 4 % maximum.

PURE TUNGSTEN FOIL 4201

Physical Characteristics

Thickness Tolerance
Thickness Available Width (Inches) Tolerance (Inches)
0.002 ± 0.0003 250 to 6
0.003 ± 0.0004 250 to 12
0.004 ± 0.0005 250 to 12
0.0049 ± 0.0007 250 to 12

Tolerance for intermediate thickness will correspond to next heavier thickness shown.

Width Tolerance
SLIT WIDTH SHEARED WIDTH (INCHES) (INCHES)
Thickness (Inches) over .500 thru 6 wide Inches over 6 thru 12 wide Inches over .500 thru 12 wide Inches
0.002 to 0.049 ± .010 ± .015 ± .031

Tungsten discs, washers and squares for power semiconductors

Tungsten is widely used as contact materials in silicon controlled rectifiers diodes, transistors and thyristors (GTO’S). Other than in specialist applications, molybdenum is now accepted as the first choice mounting material for power semiconductor devices due to its significantly lower cost and weight.

The fact that both materials have a similar coefficient of expansion to silicon combined with high thermal conductivity makes them an ideal choice, especially in large area power devices where considerable heat is generated. Further applications include the use of molybdenum and tungsten as heat sink bases in IC’S, LSI’S and hybrid circuits.

TUNGSTEN DISCS
PRODUCTION METHOD THICKNESS DIAMETER
mm inch mm inch
PUNCH 0.1 – 0.3 0.004 – 0.012 5.0 – 30.0 0.200 – 1.20
0.31 – 0.5 0.012 – 0.020 10.0 – 40.0 0.400 – 1.60
0.51 – 1.0 0.020 – 0.040 10.0 – 50.0 0.400 – 2.00
1.1 – 2.0 0.040 – 0.080 20.0 – 50.0 0.800 – 2.00
2.1 – 3.0 0.080 – 0.160 20.0 – 60.0 0.800 – 2.50

 

TUNGSTEN SQUARES
PRODUCTION METHOD THICKNESS DIAMETER
mm inch mm inch
SAW 0.010 – 0.50 0.004 – 0.020 0.50 – 10.0 0.020 – 0.40
0.51 – 1.00 0.020 – 0.040 1.00 – 70.0 0.040 – 2.80
1.10 – 2.00 0.040 – 0.080 5.00 – 75.0 0.200 – 3.00
PUNCH 0.20 – 0.50 0.008 – 0.020 5.00 – 25.0 0.200 – 1.00
0.51 – 1.00 0.020 – 0.040 15.0 – 55.0 0.600 – 2.00
1.10 – 2.00 0.040 – 0.080 10.0 – 75.0 0.400 – 3.00
EDM 0.50 – 1.00 0.020 – 0.040 10.0 – 100.0 0.400 – 4.00
1.10 – 2.00 0.040 – 0.080 10.0 – 200.0 0.400 – 0.80
2.10 – 6.00 0.080 – 0.240 20.0 – 200.0 0.800 – 8.00

Length Tolerance

For specific lengths, tolerance is + .0625 – 0 inch per foot of length. Tungsten foil is supplied in a coil having a minimum internal diameter of 3 inches, with a minimum coil length of 10 feet.

Surface Condition

Foil will have a bright finish and will be essentially free of surface defects or edge delaminations as determined by visual examination. Special mirror finish material is available upon request.

MOLYBDENUM PLATE, SHEET AND FOIL

Vacuum Arc-Cast Molybdenum Mill Products

The VAC method of consolidation is unique to H.C. Starck Solutions. Materials made by this process is available exclusively from H.C. Starck Solutions and yields a homogeneous product which is very low in residual elements, provides better strength at elevated temperatures and exhibits excellent workability, weld-ability and good machining characteristics.

In the vacuum arc-casting process, 99.95% pure molybdenum powder, ultra-pure molybdenum powder or one of our molybdenum-base alloys is pressed, sintered, and melted (all under vacuum) to produce a casting weighing up to one ton. This arc-casting is then further worked by extrusion followed by forging or rolling.

Where highest purity, maximum toughness, and ductility at low temperatures are required, arc-cast molybdenum mill products are available in a special low-carbon grade. This material is 99.97% pure molybdenum and contains a maximum of .010% residual carbon, compared to the nominal .030% maximum carbon content of normal arc-cast molybdenum.

Workability and machinability are also superior with this special product.

H.C. Starck Solutions produces a wide range of molybdenum and molybdenum alloy mill products using two primary consolidation methods; vacuum arc-casting (AC) and powder metallurgy (PM). The availability of products from both of these established processes gives users many options in selecting a material to satisfy their specific application requirements. Mill products available from either process include forging billets, bar, rod, sheet, plate and foil.

Refer to Product Data Sheets for further Molybdenum sizes:

Molybdenum Forms and Tolerances
Form Thickness Width Length
Sheet 0.005” to 0.187” 24” max. sheet **
(0.127 to 4.750 mm) (610 mm) (2.438 m) or coil*
Foil 0.001” to 0.0049” 1/2” to 12” coil
(0.0254 to 0.12 mm) ( 12.7 to 305 mm)

Molybdenum Pure Products

PD-7000 Pure Molybdenum AC Bar Low Carbon
PD-7006 Pure Molybdenum AC Bar
PD-7009 Pure Molybdenum PB PM Bar
PD-7010 Pure Molybdenum PSB PM Billet
PD-7029 Pure Molybdenum Plate PP-22-2
PD-7014 Pure Molybdenum Sheet Premium Grade PS-100-2
PD-7016 Pure Molybdenum Sheet Standard Grade PS-300-2
PD-7017 Pure Molybdenum Foil F-21-5
PD-7026 Pure Molybdenum ABL AC Bar Low Carbon
PD-7028 Pure Molybdenum ASL AC Sheet 3202 Low Carbon
PD-7030 Pure Molybdenum APL AC Plate 3203 Low Carbon

Molybdenum Alloys Products

PD-7001 Molybdenum Alloy TZM PM Sheet 2702
PD-7011 Molybdenum Alloy TZM PM Plate 2703
PD-7004 Molybdenum Alloy TZM AC Plate 3403
PD-7005 Molybdenum Alloy TZM AC Sheet 3402
PD-7021 Molybdenum Alloy TZM AFBT AC Forging Billet
PD-7025 Molybdenum Alloy TZM ABT AC Bar
PD-7031 Molybdenum Alloy P/M TZM PM Billet
PD-7043 Molybdenum Alloy ODS Mo-La PM Sheet 2602
PD-7044 Molybdenum Alloy ODS Mo-La PM Plate 2603
PD-7020 Molybdenum Alloy AFB-30W AC Forging Billet
PD-7022 Molybdenum Alloy AFB AC Forging Billet
PD-7024 Molybdenum Alloy AB-30W AC Bar
PD-7008 Molybdenum Alloy PBT PM Bar

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Discs / Squares / Cubes

ADVANTAGES

Contact material in silicon controlled rectifed diodes, transistors and thyristors.

APPLICATION

Heat Management

MARKET SEGMENT

Industrial Processing, Aerospace & Defense, Electronics

MATERIALS

Mo, Mo EBM, CuMoCu, MoCu, NiMoNi, Ta, Wcu

REQUEST A QUOTE

Please fill in the boxes on the contact form and a member of the team will contact you directly for a quotation.

Each quotation will be unique to the customer requirements so please give as much information in the contact form as possible, this will enable us to get the most accurate price back to you.


Molybdenum Discs and Squares

Molybdenum discs and squares are widely used as contact materials in silicon controlled rectifier diodes, transistors and thyristors. Molybdenum has similar coefficients of thermal expansion (CTE) to silicon combined with moderate thermal conductivity, and are therefore suitable for large area power devices where considerable heat is generated.

Further applications include the use of molybdenum as heat sink bases in IC’s, LSI’s and hybrid circuits.

Applications

  • Silicon Controlled Rectifiers Diodes
  • Transistors
  • Thyristors (GTO ‘s)

 

Tungsten as Contact Material

Tungsten discs and squares are widely used as contact materials in silicon controlled rectifier diodes, transistors and thyristors. Tungsten has similar coefficients of thermal expansion (CTE) to silicon combined with moderate thermal conductivity, and
are therefore suitable for large area power devices where considerable heat is generated.

Further applications include the use of Tungsten as heat sink bases in IC’s, LSI’s and hybrid circuits.

Applications

  • Silicon Controlled Rectifiers Diodes
  • Transistors
  • Thyristors (GTO ‘s)
  • Heat Sink Bases in IC’s, LSI’s and Hybrid Circuits

Benefits

  • CTE matched to semiconductor substrate
  • Good thermal conductivity
  • High volume production
  • Proven in high value applications

Discs/Tungsten

  • Thickness: 0.1 mm – 6.0+ mm
  • Diameter: 1.0 mm – 150.0 mm*

Squares/Tungsten 

  • Thickness: 0.01 mm – 3.0+ mm
  • Width/Length: 0.50 mm – 200.0 mm*

* depending on thickness

  • Heat Sink Bases in IC’s, LSI’s and Hybrid Circuits

Benefits

  • CTE matched to semiconductor substrate
  • Good thermal conductivity
  • High volume production
  • Proven in high value applications

Discs/Molybdenum

  • Thickness: 0.1 mm – 6.0+ mm
  • Diameter: 1.0 mm – 150.0 mm*

Squares/Molybdenum

  • Thickness: 0.01 mm – 3.0+ mm
  • Width/Length: 0.50 mm – 200.0 mm*

* depending on thickness

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Plated and Stamped Components

ADVANTAGES

High degree of biocompatibility

APPLICATION

Semiconductor, Chemical Processing Equipment, Heat Management

MARKET SEGMENT

Industrial Processing, Electronics, Aerospace & Defense

MATERIALS

Mo, CuMoCu, MoCu, NiMoNi

H.C. Starck Solutions electroplating capabilities add value to our thermal management components. We have one of the largest electroplating facilities specializing in ruthenium, rhodium, silver, gold, electroless and electrolytic nickel coatings. Various techniques are available, including PVD for single or double-sided coating, rack or barrel plating, enabling complete and comprehensive part size flexibility in addition to volume management capability – from a single component to multi-batch. Specialty coatings with Ni, Au, Ag, Ru, Rh, Pt are available for solder-wetting, etch-resistance, protective layers, and electrical contacts.

REQUEST A QUOTE

Please fill in the boxes on the contact form and a member of the team will contact you directly for a quotation.

Each quotation will be unique to the customer requirements so please give as much information in the contact form as possible, this will enable us to get the most accurate price back to you.


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Chemical Etched/Chemical Milled/Photo-Etched Parts

ADVANTAGES

Molybdenum, by buffering silicon against damaging thermal expansion whilst providing a contact of low electrical and thermal resistance, has an important part to play in determining the reliability of semiconductor devices. By selecting appropriate surface coatings, the bulk properties of molybdenum can be used to full advantage without the problems associated with the chemistry and metallurgy of its surface.

APPLICATION

Micro Machining

MARKET SEGMENT

Additive Manufacturing, Industrial Processing, Aerospace & Defense, Electronics, Medical

MATERIALS

NiMoNi, Mo, W

REQUEST A QUOTE

Please fill in the boxes on the contact form and a member of the team will contact you directly for a quotation.

Each quotation will be unique to the customer requirements so please give as much information in the contact form as possible, this will enable us to get the most accurate price back to you.


Within H.C. Starck Solutions electro-plating processes are finely tuned to ensure consistent and high quality results. Adhesion and integrity are vital to the reliability of semiconductor devices, and all coatings are diffusion bonded to the molybdenum by sintering under selected time – temperature cycles. The inter diffusion of substrate and coating then guarantee the adhesion of the surface layer, interracial and intergranular oxides are dispersed, the surface layer is annealed and consolidated and the exposed surface is cleaned and degassed. These are all ideal preparations for solder-wetting, electrical contact or corrosion protection. For soldering and alloying applications, excellent wetting and adhesion can be obtained with any hard or soft solder, eliminating the need for expensive and capricious special solders which are highly sensitive to conditions and can require unnecessarily high temperatures.

Pressure contact devices benefit from the use of discs coated to optimise tribiological and electrical contact properties, and modern techniques permit 100% adhesion of these coatings whilst providing less than one micron flatness deviation.

Coatings can be supplied on one, both, or all sides of the product and our technical staff are always available to advise the best coating for your application.

Example coatings and applications for Molybdenum

COATING / THICKNESS APPLICATION
Nickel 1-2 microns Pressure Contact (or light duty soft soldering). May be base layers for precious metal in these applications.
Nickel 5 microns Solder wetting A firmly bonded base layer whose resistance to passivation may be enhanced by further layers (see below).
Nickel 25 microns Solder wetting and etch resistance an economically applied layer, it retains a solderable surface after heavy etching and also facilitates re-work of failed devices.
Nickel 5 microns +

Gold 1-2 microns

A) solder wetting     B) Electrical contact
C) Etch resistance   D) Au-sieutectic bonding
Nickel 5 microns +

copper 5 microns

Solder wetting for soft soldering
Nickel 5 microns +
gold 0.5 microns +
silver 5 microns
Solder wetting An intermediate gold layer enhances adhesion at high temperature.
Nickel 1-2 microns +
Copper 50-100 +
Nickel 3-5 microns
Superior multi layer system to Cu-Mu-Cu composites used for PCB heatsinks and hybrid ciruit substrates. Offering high integrity diffusion bond avoiding the problems of interfacial contaminant leaching.
Gold (alone) Excellent protective layer which can be applied without heat treatment to produce extremely flat discs for pressure-assembly applications.
Rhodium 0.3 microns A) Electrical contact Very low, stable electrical contact resistance and excellent tribological properties make Rhodium an ideal pressure-contact coating.
B) Solder wetting Wetted by both aluminum-based and silver-based solders.
Ruthenium 0.3 microns Same application as Rhodium with the advantage of being significantly cheaper
Platinum 0.5 microns +
silver 5 microns
Spacecraft Solderable non-magnetic coating with excellent electrical properties
Electroless Nickel* High uniformity of thickness with excellent chemical and physical properties. Particulary beneficial when coating complex parts.
*Not an electrolytic process. Deposition is dependant on autocatalytic effect.
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