Additive Manufacturing/3D Printing

ADVANTAGES

Additive manufacturing (AM), also known as 3D printing, has been discovered as a real “game changer” because it opens completely new possibilities for many industries. The innovative technology leads to entirely new ways of manufacturing custom-made components and highly complex elements that have been unthinkable to produce with conventional technologies before.

APPLICATION

MARKET SEGMENT

MATERIALS

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Please fill in the boxes on the contact form and a member of the team will contact you directly for a quotation.

Each quotation will be unique to the customer requirements so please give as much information in the contact form as possible, this will enable us to get the most accurate price back to you.


H.C. Starck Solutions offers 3D printing technology metals and their alloys as well as services to support its customers to fully benefit from the unique advantages of Additive Manufacturing.

Our powders are engineered for the whole range of additive manufacturing processes, including:

  • Selective Laser Sintering (SLS)
  • Laser Beam Melting (EBM)
  • Laser Metal Deposition (LMD)
  • Electron Beam Melting (EBM)
  • Direct Metal Deposition (DED)
  • Direct Metal Laser Sintering (DMLS)
  • Rapid Prototyping (RP)
  • Rapid Manufacturing (RM)
  • 3D Printing (3DP)

Spherical Refractory Metal Powders Optimized for Additive Manufacturing

Based on 100 years’ experience in manufacturing and development of refractory metals, H.C. Starck Solutions has developed spheroidized refractory metal powders with tailored chemistry and particle size distribution, perfectly suited for additive manufacturing technology. The company‘s core competencies – molybdenum and  tungsten in pure and alloyed powder forms, will take advantage of this innovative process.

3D Printing Produces Finished Parts

In addition, H.C. Starck Solutions develops innovative finished products using technology metals – molybdenum, tantalum, niobium, and tungsten, and produced via additive manufacturing processes. H.C. Starck is developing new materials, processes and products using additive manufacturing tools. In 2014, H.C. Starck Solutions entered an agreement with Rapid Prototype and Manufacturing (rp+m) to develop new materials, processes and products using additive manufacturing tools. (press release)

For example, by using additive manufacturing, a single-piece molybdenum or tungsten component for medical imaging equipment can be produced more efficiently and to the most exacting specifications. Also, additive manufacturing provides the capability to rapidly develop prototype products that extend to production levels.

With additive manufacturing, a product can be designed and a sample created in a fraction of the time compared to traditional manufacturing. A single-piece component made from molybdenum or tungsten can be produced without the previously required manufacturing steps. Production processes such as the pressing and sintering of powder, rolling, machining and assembly of components are eliminated, making it easier and faster to seamlessly deliver products to customers using additive manufacturing technology.

3D printed components can be made as a single, three-dimensional piece from a 3D model. For example by selectively depositing a liquid bonding agent to join the powder, one or more metal parts can be printed at once from various materials. Thus, H.C. Starck Solutions product portfolio can be expanded to include 3D lead-free products for collimators and anti-scatter grids for CT scanners, SPECT and gamma cameras.

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Rod / Wire / Coil

ADVANTAGES

High degree of biocompatibility

APPLICATION

Superconductivity, High Temperature Vacuum Furnace

MARKET SEGMENT

Industrial Processing, Aerospace & Defense, Electronics, Medical, Additive Manufacturing

MATERIALS

Mo, Mo EBM, TZM, Nb, Nb EBM, Grain Stabl. Nb, Ta, Ta EBM, W, WHA, NRC76, Ultra 76, Ultra 76 Plus, Ta3W, Ta10W, C-103

REQUEST A QUOTE

Please fill in the boxes on the contact form and a member of the team will contact you directly for a quotation.

Each quotation will be unique to the customer requirements so please give as much information in the contact form as possible, this will enable us to get the most accurate price back to you.


 

NIOBIUM ROD

H.C. Starck Solutions offers NRC® niobium metal produced from electron beam melted ingots. Grain Stabilized Niobium (GSNb) is made by EB and VAR melting. Both materials are malleable, weldable, machineable and formable. GSNb is used in applications where a consistently finer grain size is required.

GSNb is a patent pending single-phase micro-alloy that has a grain size of approximately 2 ASTM numbers finer than standard commercial grade niobium.

Niobium is used in the manufacture of products for diverse applications.

  • Synthetic diamonds
  • Sputtering targets for fiber optic applications or architectural glass
  • Nickel based superalloys; and alloyed with titanium or tin
  • Superconductors
  • Nuclear reactors it has low thermal neutron cross section and superior corrosion resistance
  • High temperature vacuum furnaces, where it is an excellent getter
  • Sodium vapor lamps, where it is resistant to attack by the molten alkali

Niobium rod is worked cold from ingot to final diameter. Forging, rolling, swaging, and drawing are used singularly or in combination to reach the desired size. Proprietary techniques have been developed by H.C. Starck Solutions to overcome the metal’s extremely high-galling tendencies.

Rod is generally supplied with a forged surface above 1-3/8″ diameter, and a swaged or drawn finish in smaller diameters. Rod, preferably un-annealed, may be centerless ground to improve diameter tolerances. The minimum diameter for centerless grinding is .125″. Rod to a maximum of 1/4″ and wire may be supplied in coils or straightened and cut to length.

TANTALUM ROD,  WIRE, COIL

A favorite with chemical processing applications that require anti-corrosion characteristics is tantalum rod including the manufacturer of components for anticorrosion equipment.

Outstanding refractory, anti-corrosion and biocompatibility properties make our tantalum wire a unique material for selected applications. Customers transform our tantalum wire into leads for Ta capacitors in electronic, anti-corrosion chemical processing, biomedical devices for medical applications, and filaments for lighting applications.

H.C. Starck Solutions tantalum rod is worked cold from ingot to final diameter. Forging, rolling, swaging, and drawing are used singularly or in combination to reach the desired size.

Proprietary techniques have been developed by H.C. Starck Solutions to overcome the metal’s extremely high-galling tendencies. Special lubricants and die design, as well as suitable speeds and reductions per pass, are all a part of cold drawing tantalum.

Our tantalum rod is generally supplied with a forged surface above 1-3/8″ diameter and a swaged or drawn finish in smaller diameters. The rod, preferably unannealed, may be centerless ground to improve diameter tolerances. The minimum diameter for centerless grinding is .125″.

H.C. Starck Solutions tantalum rod is produced to a maximum of 1/4″ and wire may be supplied in coils or straightened and cut to length.

Tantalum wire with a diameter of 0.040“or below is shipped on spools.

ULTRA76 tantalum alloys offer higher corrosion resistance in most environments creating additional value through extending the products service life, reducing material thickness and improving processes throughput.

  • Higher temperatures possible, shorter cooling/heating cycle times
  • Constant surface finish (Ra<0.8 micrometers)
  • Tantalum material only from non-conflict sources – EICC certified
  • Uniform wall thickness

Dimensions

Form Thickness, Dia., Wall
inches (mm)
Width, Length
inches (mm)
Rod 0.125“ to 0.625“
(3.175 to 15.875 mm dia.)
0.625“ to 3.000“ dia.
(15.875 to 76.200 mm dia.)
coil or straight lengths

straight lengths

Wire 0.010“ to 0.125“ dia.
(0.254 to 3.175 mm dia.)
coil
Coil 0.028″ to 0.125″ dia.
(0.711 to 3.175 mm dia.)
coil

Please contact us for additional sizes and requirements.

Tantalum and Tantalum Alloy Products:

Refer to Product Data Sheets for Tantalum for sizes:

– PD-7033 NRC Ultra 76 Tantalum Alloy (Ta 2.5%W)
– PD-7035 NRC Tantalum (UNS R05200)
– PD-7036 NRC Tantalum Beam Melted Tantalum (ETA) (UNS R05200)

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Collimators/Anti scatter grids

ADVANTAGES

Collimators, or anti-scatter grids, are critical components for radiation management in computerized tomography (CT) scanning. They are typically manufactured using dense refractory metals and alloys such as tungsten (W) and tungsten heavy alloy (WHA) due to the materials’ superb attenuation characteristics for X-radiation – the chief wavelength range used to generate detailed CT scans.

APPLICATION

Radiation Management

MARKET SEGMENT

Medical, Additive Manufacturing

MATERIALS

Mo, W, WHA, WCu

REQUEST A QUOTE

Please fill in the boxes on the contact form and a member of the team will contact you directly for a quotation.

Each quotation will be unique to the customer requirements so please give as much information in the contact form as possible, this will enable us to get the most accurate price back to you.


With unmatched experience in the fabrication of high-technology parts using refractory metals and alloys, like tungsten and molybdenum (Mo), H.C. Starck Solutions can reliably produce and supply collimators for radiation management in CT scanners and radiotherapy applications.

Collimators for Radiation Management

Collimators manage radiation by either focusing an X-ray source into a manageable, parallel beam of rays that is directed onto an area of interest, or by absorbing scattered rays before they enter photodetectors. Lead (Pb) and depleted uranium have been used in the past, but tungsten has emerged as the ideal replacement for multi-leaf collimators in radiation therapy beam focusing and detector plates in CT scanners for a number of reasons.

Tungsten is a remarkable metal with a notably high density (~19.3g/cm3), which makes it suited for radiation shielding in complex medical apparatuses. It is widely used in the medical diagnostics market to fabricate collimators for both beam focusing and CT scanner assemblies. The outstanding mechanical properties complicate its workability, however, and the fabrication of multi-leaf tungsten collimators requires significant experience in precision machining and tolerancing of refractory metal parts.  

H.C. Starck Solutions fabricated products and services are routinely supplied as robust solutions for intricate challenges in the medical technology sector. With high capability inspection equipment and unmatched expertise in working dense metals like tungsten, H.C. Starck Solutions has emerged as one of the leading suppliers of collimators for CT scanning and radiotherapy applications. All fabricated components can be rapidly and reliably finished, with a contact-free quality assurance and control process guaranteeing components are form fit with a resolution of approximately 0.1 – 1 micrometer (μm).

If you would like more information about H.C. Starck Solutions collimators, please do not hesitate to contact the team today.

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Chemical Etched/Chemical Milled/Photo-Etched Parts

ADVANTAGES

Molybdenum, by buffering silicon against damaging thermal expansion whilst providing a contact of low electrical and thermal resistance, has an important part to play in determining the reliability of semiconductor devices. By selecting appropriate surface coatings, the bulk properties of molybdenum can be used to full advantage without the problems associated with the chemistry and metallurgy of its surface.

APPLICATION

Micro Machining

MARKET SEGMENT

Additive Manufacturing, Industrial Processing, Aerospace & Defense, Electronics, Medical

MATERIALS

NiMoNi, Mo, W

REQUEST A QUOTE

Please fill in the boxes on the contact form and a member of the team will contact you directly for a quotation.

Each quotation will be unique to the customer requirements so please give as much information in the contact form as possible, this will enable us to get the most accurate price back to you.


Within H.C. Starck Solutions electro-plating processes are finely tuned to ensure consistent and high quality results. Adhesion and integrity are vital to the reliability of semiconductor devices, and all coatings are diffusion bonded to the molybdenum by sintering under selected time – temperature cycles. The inter diffusion of substrate and coating then guarantee the adhesion of the surface layer, interracial and intergranular oxides are dispersed, the surface layer is annealed and consolidated and the exposed surface is cleaned and degassed. These are all ideal preparations for solder-wetting, electrical contact or corrosion protection. For soldering and alloying applications, excellent wetting and adhesion can be obtained with any hard or soft solder, eliminating the need for expensive and capricious special solders which are highly sensitive to conditions and can require unnecessarily high temperatures.

Pressure contact devices benefit from the use of discs coated to optimise tribiological and electrical contact properties, and modern techniques permit 100% adhesion of these coatings whilst providing less than one micron flatness deviation.

Coatings can be supplied on one, both, or all sides of the product and our technical staff are always available to advise the best coating for your application.

Example coatings and applications for Molybdenum

COATING / THICKNESS APPLICATION
Nickel 1-2 microns Pressure Contact (or light duty soft soldering). May be base layers for precious metal in these applications.
Nickel 5 microns Solder wetting A firmly bonded base layer whose resistance to passivation may be enhanced by further layers (see below).
Nickel 25 microns Solder wetting and etch resistance an economically applied layer, it retains a solderable surface after heavy etching and also facilitates re-work of failed devices.
Nickel 5 microns +

Gold 1-2 microns

A) solder wetting     B) Electrical contact
C) Etch resistance   D) Au-sieutectic bonding
Nickel 5 microns +

copper 5 microns

Solder wetting for soft soldering
Nickel 5 microns +
gold 0.5 microns +
silver 5 microns
Solder wetting An intermediate gold layer enhances adhesion at high temperature.
Nickel 1-2 microns +
Copper 50-100 +
Nickel 3-5 microns
Superior multi layer system to Cu-Mu-Cu composites used for PCB heatsinks and hybrid ciruit substrates. Offering high integrity diffusion bond avoiding the problems of interfacial contaminant leaching.
Gold (alone) Excellent protective layer which can be applied without heat treatment to produce extremely flat discs for pressure-assembly applications.
Rhodium 0.3 microns A) Electrical contact Very low, stable electrical contact resistance and excellent tribological properties make Rhodium an ideal pressure-contact coating.
B) Solder wetting Wetted by both aluminum-based and silver-based solders.
Ruthenium 0.3 microns Same application as Rhodium with the advantage of being significantly cheaper
Platinum 0.5 microns +
silver 5 microns
Spacecraft Solderable non-magnetic coating with excellent electrical properties
Electroless Nickel* High uniformity of thickness with excellent chemical and physical properties. Particulary beneficial when coating complex parts.
*Not an electrolytic process. Deposition is dependant on autocatalytic effect.
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